US-FED-00000387254 - Synopsis for Semiconductor Device Assembly (Diode Box) (NSN 5961-01-522-9461CX / PN 816-3385-001) - Deadline August 5,2026

This action is to award a one–time buy contract for the Semiconductor Device Assembly (Diode Box) (NSN [ phno? redacted ]461CX / PN [ phno? redacted ]. Required delivery will consist of a First Article (FA) requirement of 2 ea. and then full rate production quantity of 68 ea. upon approval of FA testing. Ship To: SW3119 / F.O.B. Origin. Award is anticipated on or before 30 September 2026 with period of performance running through September 2027.The Semiconductor Device Assembly provides for isolation between various electrical components on the KC–135 and similar platforms.The Government will provide technical data to responsible, interested parties upon request. The awardee will be required to manufacture assets in accordance with the FA test requirements and specifications as approved by the Government.