SW-115267 - USA (Washington, DC) - High-Throughput Embarked Data Transfer Solution - Deadline July 22,2026

– Vendor needs to provide high–throughput embarked data transfer solution.– Develop a small form factor device (total stowed volume of one cubic foot, including transceiver) and any required software to enable high–throughput data package transmission off embarked Navy platforms. – System Engineering Agent (CSEA), which is expected to take place on a surface combatant equipped with CMS software, demonstrating the full end–to–end data transmission process between the surface combatant and a government ashore analysis and support activity.– Develop a prototype small form factor device to enable high–throughput data package transmission and any required software capabilities that enable integration.– Dual–use applications to consider include extension of these technologies and capabilities to expeditionary or remote use cases where exceptionally high throughput data package transmissions are required.