EXTRA-78304 - USA (Columbia, Missouri) - Atomic Layer Deposition System - Deadline November 3,2026

(1) Vendor needs to provide atomic layer deposition system to the government authority located in Columbia, MO.– Atomic layer deposition system will be used in the undergraduate courses offered in the new cleanroom.– Substrate capability coupon pieces 1cm x 1cm through 6–inch wafers.– Thermal ALD.– Remote Plasma PEALD.– Load lock.– 6 precursor sources.– Ti, Hf, Al precursor.– Capability to deposit with initial process recipes for Al2O3, HfO2, SiO2, TiO2, TiN, AlN.– Heated precursor bubblers and delivery lines.– H2O oxidant.– O2 plasma.– Wafer temperature: preferably RT–400°C or higher.(2) All the questions must be submitted no later than October 27, 2026.(3) The contract period will be for two years.