AI-1346 - USA (Washington, DC) - AI/ML Verification of Microelectronic Integrity Service for High-Assurance Systems - Deadline January 6,2027

(1) Vendor needs to provide AI/ML verification of microelectronic integrity service for high–assurance systems. • Develop an innovative, Artificial Intelligence / Machine Learning (AI/ML) driven methodology and prototype architecture capable of non–destructively verifying the physical and logical integrity of Integrated Circuits• Solution must reliably detect sub–nanometer, adversarial Hardware Trojans that evade conventional functional testing• AI–driven inspection capability to mitigate these threats. • Solution should ingest a Level 3 Technical Data Package (TDP) or Model–Based Systems Engineering (MBSE) Digital Twin to establish a definitive baseline of intended logic gate behavior.