EQU-19474 - USA (Columbia, Missouri) - Physical Vapor Deposition System - Deadline August 27,2026

(1) Vendor needs to provide physical vapor deposition system to the government authority located in Columbia, MO.• RequirementsA. Process Substrates from 1 cm x 1 cm pieces up to 6–inches diameter wafer.B. Turbo pump and dry vacuum pump, base pressure ≤ 5E–7 torrC. Three thermal evaporation sources with shutters and power supplies (or controllers) for sequential and codepositionof 2 sources.D. Three magnetron sputtering sources for 2–inch or 3–inch targets, includingi. One high–strength source for deposition of magnetic materialsii. Two DC power suppliesiii. Two RF power suppliesiv. Power supply switch for sequential and co–depositionv. Gas pressure control: three MFC controlled process gas lines (O2, N2, Ar) with gas control for reactivesputteringvi. Three source shuttersE. Three calibrated single crystal deposition rate sensors with film thickness controller (monitor)F. Substrate stage to accommodate one 6–inch substrate or smaller pieces, includingi. Rotation with variable speedii. Backside substrate heatingiii. Pneumatically actuated substrate shutteriv. Adjustable source to substrate distance, manual or motorized(2) The contract period will be for one year.(3) All the questions must be submitted no later than August 24, 2026.