EQU-19892 - USA (Columbia, Missouri) - Plasma Enhanced Chemical Vapor Deposition System - Deadline September 29,2026

(1) Vendor needs to provide plasma enhanced chemical vapor deposition system to the government authority located in Columbia, MO.• Capable of processing substrates from 1 cm x 1 cm pieces to 6–inch diameter wafer• Capable of depositing silicon dioxide and silicon nitride films• 208 VAC.• Temperature–controlled substrate and upper electrode• Endpoint detection system(2) All questions must be submitted no later than September 24, 2026.