Sign in Get started

← All opportunities

JustificationActive26-6E6

Wire Bonder Training and Preventative Maintenance

DEPT OF DEFENSE / DEFENSE MICROELECTRONICS ACTIVITY (DMEA) / DEFENSE MICROELECTRONICS ACTIVITY

Key dates?

Posted?: Jul 13, 2026
Response deadline?: —
Archive date?: —
Archive type?: auto30

Classification?

Notice type?: Justification
Base type?: Justification
Set-aside?: —
Set-aside code?: —
PSC?: J036

NAICS?

333242Semiconductor Machinery Manufacturing

Issuing office?

Department?: DEPT OF DEFENSE
Sub-tier?: DEFENSE MICROELECTRONICS ACTIVITY (DMEA)
Office?: DEFENSE MICROELECTRONICS ACTIVITY
Office code?: 097.9771.HQ0727
Organization type?: OFFICE
Office address?: MCCLELLAN, CA, 956522100, USA

Place of performance?

Street?: —
Street 2?: —
City?: —
State?: California
Zip?: 95652
Country?: UNITED STATES

Contacts?

Shawndae Wilkinsprimary
shawndae.e.wilkins.civ@mail.mil (awards)2794991835

Description?

Preventative Maintenance and Advanced Training for Wire Bonding specific to KnS products.

Attachments (2)?

📎 JA+26-6E6.pdf
application/pdf · 230 KB
Download
Sign in to extract text
📎 26-6E6+SOW+KnS+Ball+Bonder+Training+and+PM_Redacted.pdf
application/pdf · 82 KB
Download
Sign in to extract text

Award?

Number?: HQ072726PE009
Amount?: —
Date?: —
Awardee?: —
UEI?: —
Awardee address?: —

Similar open contracts

Metadata?

Notice ID?: 8b3dbeaea3f944b78bb4eb7d2f14dbcf
Full path?: DEPT OF DEFENSE.DEFENSE MICROELECTRONICS ACTIVITY (DMEA).DEFENSE MICROELECTRONICS ACTIVITY
Office code?: 097.9771.HQ0727
Ingested?: Jul 14, 2026
Updated?: Jul 14, 2026