Special NoticeArchivedW52P1J26R0001

Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies

DEPT OF DEFENSE / DEPT OF THE ARMY / DEPT OF THE ARMY

All open bids & awards from Department of Defense →

Key dates?

Posted?: Aug 17, 2026
Response deadline?: Sep 16, 2026, 10:00 PM UTC
Archive date?: Oct 1, 2026
Archive type?: auto15

Classification?

Notice type?: Special Notice
Base type?: Special Notice
Set-aside?: —
Set-aside code?: —
PSC?: R425

NAICS?

541715Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)

Issuing office?

Department?: DEPT OF DEFENSE
Sub-tier?: DEPT OF THE ARMY
Office?: DEPT OF THE ARMY
Office code?: —
Organization type?: AGENCY
Office address?: —

Contacts?

Christopher Mauerprimary
christopher.s.maurer2.civ@army.mil (awards)5207142318

Summary?

DEPT OF DEFENSE has posted an open Special Notice: Secure Packaged Microelectronic Components, Printed Circuit Boards, and Supporting Technologies. Responses are due September 16, 2026. Reference number: W52P1J26R0001.

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Metadata?

Notice ID?: 847923bf1b0641ec9b63d67f4ef2fd1d
Full path?: DEPT OF DEFENSE.DEPT OF THE ARMY.DEPT OF THE ARMY
Office code?: —
Ingested?: Aug 25, 2026
Updated?: Aug 25, 2026